Gpixel
GLT5008BSI-AUM-HUN-BRD CMOS image sensor
MPN: GLT5008BSI-AUM-HUN-BRD

GLT5008BSI-AUM-HUN-BRD is a Gpixel CMOS image sensor in the GLT5008BSI family. 8k bsi tdi (time delay integration) line scan image sensor. Ordering configuration: High speed, 1M HZ (10 bit) 72 x Sub-LVDS.231 pins μPGA package.Removable D263 ® Teco glass lid with AR coating on both sides,Demo Grade. Specifications below include family-level capabilities; confirm the selected configuration before ordering. Pricing, availability and lead time are available on request.
Specifications
| ADC | 10/12 bit |
|---|---|
| Availability | Engineering Samples (ES) |
| Channel Multiplexing | 72/54/48/36/24/18/12/6 (10 bit) |
| Chroma | Mono |
| Dark Current | 1 ke⁻/pixel/s (P1 10/12 bit,single band,15 ℃) |
| Dynamic Range | 62.8 dB (P1,10 bit,single band) 67.6 dB (P1,12 bit,single band) |
| Full Well Capacity | 16.8 ke⁻ (P1,10 bit,single band) 17.8 ke⁻ (P1,12 bit,single band) |
| Max Line Rate | 1M Hz (10 bit) 500k Hz (12 bit) |
| Max. Data Rate | 86.4 Gbps (10 bit) |
| Max. SNR | 42.3 dB (10 bit) |
| Nr of Active Pixels | P1: 8208 pixels x 256 stages P2: 8208 pixels x 32 stages |
| Optical Format | 41.04 mm |
| Ordering variant | High speed, 1M HZ (10 bit) 72 x Sub-LVDS.231 pins μPGA package.Removable D263 ® Teco glass lid with AR coating on both sides,Demo Grade |
| Output Format | 72 ch Sub-LVDS (10 bit) |
| Package | μPGA 231 pins (56.90 mm x 19.00 mm) |
| Peak QE | 65.8 % (266 nm) 94.2 % (460 nm) |
| Photosensive Area | P1: 41.04 mm x 1.28 mm P2: 41.04 mm x 0.16 mm |
| Pixel Size | 5 μm x 5 μm |
| Power Consumption | ≤ 4.1 W (P1,10 bit,1 MHz line rate) ≤ 3.2 W (P1,12 bit,500 kHz line rate) |
| Resolution | 8.2K |
| Sensor family | GLT5008BSI |
| Shutter Type | Time Delay Integration |
| Supply Voltage | 3.3 V (analog) 1.65 V (ADC) 1.6 V (digital) |
| Temporal Noise | 12.1 e⁻ (P1,10 bit,single band) 7.4 e⁻ (P1,12 bit,single band) |
Before ordering
- Minimum and maximum supply voltage, including transients
- Continuous and peak load, cooling and ambient temperature
- Isolation, mechanical envelope and mounting requirements